Arrhenius Characterization of ILD and Copper CMP Processes-Reference-Cited by-同舟云学术

Arrhenius Characterization of ILD and Copper CMP Processes

Published:2004 Issue:2 Volume:151 Page:G85
ISSN:0013-4651
Container-title:Journal of The Electrochemical Society
language:en
Short-container-title:J. Electrochem. Soc.

Author:

Sorooshian J.,DeNardis D.,Charns L.,Li Z.,Shadman F.,Boning D.,Hetherington D.,Philipossian A.

Publisher

The Electrochemical Society

Subject

Materials Chemistry,Electrochemistry,Surfaces, Coatings and Films,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference17 articles.

1. Friction and thermal phenomena in chemical mechanical polishing

2. J. Sorooshian, D. DeNardis, L. Charns, Z. Li, D. Boning, F. Shadman, and A. Philipossian, inProceedings of CMP-MIC, VMIC, IEEE, p. 43, (2003).

3. H. Chiou, Z. Lin, L. Kuo, S. Shih, L. Chen, and C. Hsia, inProceedings of the International Interconnect Technology Conference, IEEE, p. 83, (1999).

4. K. Wijekoon, S. Tsai, D. Bennett, M. Chandrachood, R. Abbassi, F. Redeker, and R. Tooles, Abstract 1221, The Electrochemical Society and The Electrochemical Society of Japan Meeting Abstracts, Vol. 99-158, Honolulu, HI, Oct 17-22, 1999.

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