Author:
Kim H.J,Kim H.Y,Jeong H.D,Lee E.S,Shin Y.J
Subject
Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modelling and Simulation,Ceramics and Composites
Reference10 articles.
1. AT&T Bell Laboratory, CMP mechanism identified at Bell Laboratory, Solid State Technol. 37 (12) (1994) 26.
2. Kinematic analysis and measurement of temperature rise on a pad in chemical mechanical planarization;Hocheng;J. Electrochem. Soc.,1999
3. J.M. Steigwald, Chemical Mechanical Planarization of Microelectronic Materials, Wiley, New York, 1997, pp. 74–83.
4. Karl-heinz, Z. Gahr, Microstructure and Wear of Materials, Elsevier, New York, 1987, p. 72.
5. Chemical process in glass polishing;Cook;J. Non-Crystall. Solids,1990
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