Molecular simulation of ultrasonic assisted diamond grit scratching 4H-SiC single-crystal
Author:
Funder
China Postdoctoral Science Foundation
Publisher
Elsevier BV
Reference69 articles.
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1. Microscopic removal mechanism of 4 H-SiC during abrasive scratching in aqueous H2O2 and H2O: Insights from ReaxFF molecular dynamics;Tribology International;2024-12
2. Scratching properties of 4H–SiC single crystal after oxidation under different conditions;Wear;2024-11
3. Molecular dynamics simulations in semiconductor material processing: A comprehensive review;Measurement;2024-09
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