Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging-Reference-Cited by-同舟云学术

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Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging

Published:2020-07-01 Issue:2 Volume:33 Page:171-176
ISSN:0914-9244
Container-title:Journal of Photopolymer Science and Technology
language:en
Short-container-title:J. Photopol. Sci. Technol.

Author:

Okada Yuji¹,Fujii Atsushi¹,Ono Kenta²,Kariya Yoshiharu³

Affiliation:

1. Fab Materials Research & Development Department, Electronics and Functional Products Division, Asahi Kasei Corporation

2. Graduate School of Shibaura Institute of Technology

3. Department of Materials Science and Engineering, Shibaura Institute of Technology

Publisher

Technical Association of Photopolymers, Japan

Subject

Materials Chemistry,Organic Chemistry,Polymers and Plastics

Link

https://www.jstage.jst.go.jp/article/photopolymer/33/2/33_171/_pdf

Reference3 articles.

1. 1. A. J. Kinloch, C. C. Lau, and J. G. Williams, Int. J. Fract., 66 (1994) 45.

2. 2. T.-C. Chiu and H.-C. Lin, Int. J. Fract., 156 (2009) 75.

3. 3. J. Augersperg R. Dudek, and B. Michel, Proc. 12th Electron. Packag. Technol. Conf., 12 (2010) 632.

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Interconnect Reliability Simulation Analysis of Fan-out Package redistribution Layer;2023 8th International Conference on Integrated Circuits and Microsystems (ICICM);2023-10-20

2. Recent Trend of Advanced LSI Packaging: Introduction for application of polymers;Journal of Photopolymer Science and Technology;2023-06-15

3. Effect of sodium thiazolinyl dithiopropane sulphonate (SH110) addition on electroplating nanotwinned copper films and their filling performance of fine-pitch redistributed layer (RDL);Nanotechnology;2022-10-20

4. Fracture Simulation of Redistribution Layer in Fan-Out Wafer-Level Package Based on Fatigue Crack Growth Characteristics of Insulating Polymer;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05

5. Finite Element Analysis of Delamination of Redistribution Layer in Semiconductor Package Structure;Journal of Smart Processing;2021

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