Fracture Simulation of Redistribution Layer in Fan-Out Wafer-Level Package Based on Fatigue Crack Growth Characteristics of Insulating Polymer
Author:
Affiliation:
1. Asahi Kasei Corporation,Fab Materials Research & Development Department,Fuji-shi, Shizuoka,Japan
2. Shibaura Institute of Technology,Department of Materials Science and Engineering,Koto-ku, Tokyo,Japan
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/9816066/9816372/09816594.pdf?arnumber=9816594
Reference8 articles.
1. FRACTURE MECHANICS Fundamentals and Application Fourth Edition;anderson,2016
2. Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging
3. Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
4. The peeling of flexible laminates
5. Adhesion and interface chemical reactions of Cu/polyimide and Cu/TiN by XPS
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