Advancements in mechanical characterization techniques and environmental effects on bi-material interfaces in microelectronics: a literature review-Reference-Cited by-同舟云学术

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Advancements in mechanical characterization techniques and environmental effects on bi-material interfaces in microelectronics: a literature review

Published:2024-05-09 Issue: Volume: Page:1-33
ISSN:0021-8464
Container-title:The Journal of Adhesion
language:en
Short-container-title:The Journal of Adhesion

Author:

Ferreira Renato A.¹,Akhavan-Safar Alireza²^ORCID,Carbas Ricardo J. C.¹²,Marques Eduardo A. S.¹,Karunamurthy Bala³,da Silva Lucas F. M.¹

Affiliation:

1. Departamento de Engenharia Mecânica, Faculdade de Engenharia (FEUP), Universidade Do Porto, Porto, Portugal

2. Institute of Science and Innovation in Mechanical and Industrial Engineering (INEGI), Porto, Portugal

3. Infineon Technologies Austria AG, Villach, Austria

Publisher

Informa UK Limited

Link

https://www.tandfonline.com/doi/pdf/10.1080/00218464.2024.2351977

Reference100 articles.

1. The Czochralski Method - where we are 90 years after Jan Czochralski’s invention

2. Semiconductor Packaging

3. Greig, W. Integrated Circuit Packaging, Assembly and Interconnections; New York, USA: Springer Science & Business Media, 2007.

4. 3D Microelectronic Packaging

5. Wafer level packaging of MEMS

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