Finite Element Analysis of Delamination of Redistribution Layer in Semiconductor Package Structure
Author:
Affiliation:
1. Graduate School of Shibaura Institute of Technology
2. Department of Material Science and Engineering, Shibaura Institute of Technology
Publisher
Sumart Processing Society for Minerals, Environment and Energy
Link
https://www.jstage.jst.go.jp/article/jspmee/10/5/10_286/_pdf
Reference12 articles.
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2. K. Ono and Y. kariya: “Failure Analysis of Redistribution Layerin Semiconductor Package Structure”, Proceeding of 26 th symposium on “Micorojoining and Assembly Technology in Electronics” (mate2020), 26, (2020), 171-174.
3. Y. Okada et al.: “Reliability Simulation with the Finite Element Analysis (FEA) of Redistribution Layer in Fan-out Wafer Level Packaging”, Journal of Photopolymer Science and Technology, 33, (2020), 171-176.
4. A.J. Kinloch et al.: “The Peeling of Flexible Laminates”, International Journal of Fracture, 66, (1994), 45-70.
5. Y Kanda et al.:“Visco-elastic Effect of Underfill Material in Reliability Analysis of Flip-Chip Package”. ASME InterPACK’09, (2009), 755-759.
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