Surface Activation by Electrolytically Ionized Slurry during Cu CMP
Author:
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference18 articles.
1. Mechanical aspects of the chemical mechanical polishing process: A review
2. Investigation of pad wear in CMP with swing-arm conditioning and uniformity of material removal
3. Electrochemical Analysis of the Slurry Composition for Chemical Mechanical Polishing of Flexible Stainless-Steel Substrates
4. Estimating the mechanical properties of polyurethane-impregnated felt pads
5. Slurry components in metal chemical mechanical planarization (CMP) process: A review
Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Material Removal Characteristics of Abrasive-Free Cu Chemical-Mechanical Polishing (CMP) Using Electrolytic Ionization via Ni Electrodes;Micromachines;2023-01-20
2. Approaches to Sustainability in Chemical Mechanical Polishing (CMP): A Review;International Journal of Precision Engineering and Manufacturing-Green Technology;2021-11-26
3. Electrolytically Ionized Abrasive-Free CMP (EAF-CMP) for Copper;Applied Sciences;2021-08-05
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