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Effect of NH2OH on Etching Characteristics of Si{100} in KOH Solution

  • Published:2017 Issue:9 Volume:6 Page:P609-P614
  • ISSN:2162-8769
  • Container-title:ECS Journal of Solid State Science and Technology
  • language:en
  • Short-container-title:ECS J. Solid State Sci. Technol.

Author:

Rao Avvaru Venkata Narasimha,Swarnalatha Veerla,Ashok Akarapu,Singh Sajal Sagar,Pal Prem

Funder

Department of Science and Technology, Ministry of Science and Technology (DST)

Council of Scientific and Industrial Research (CSIR)

Publisher

The Electrochemical Society

Subject

Electronic, Optical and Magnetic Materials

Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Wet anisotropic etching characteristics of Si{111} in NaOH-based solution for silicon bulk micromachining;Micro and Nano Systems Letters;2022-12-01

2. Effect of IPA on Micromachining Characteristics of Silicon in KOH-Based Solution;Microactuators, Microsensors and Micromechanisms;2022-11-21

3. Etching Characteristics of Si{110} in NaOH Based Solution;Microactuators, Microsensors and Micromechanisms;2022-11-21

4. Enhanced etching characteristics of Si{100} in NaOH-based two-component solution;Micro and Nano Systems Letters;2022-08-01

5. A review on the mainstream through-silicon via etching methods;Materials Science in Semiconductor Processing;2022-01
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