A review on the mainstream through-silicon via etching methods-Reference-Cited by-同舟云学术

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A review on the mainstream through-silicon via etching methods

Published:2022-01 Issue: Volume:137 Page:106182
ISSN:1369-8001
Container-title:Materials Science in Semiconductor Processing
language:en
Short-container-title:Materials Science in Semiconductor Processing

Author:

Guo Haoming^ORCID,Cao Shengbin,Li Lei,Zhang Xiaofeng

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference87 articles.

1. Chapter 2 - limits and hurdles to continued CMOS scaling, handb;Seshan,2018

2. 3-D Integration and Through-Silicon Vias in MEMS and Microsensors

3. US Pat;William,1962

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