Author:
Sorooshian J.,Borucki L.,Timon R.,Stein D.,Boning D.,Hetherington D.,Philipossian A.
Publisher
The Electrochemical Society
Subject
Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering
Reference7 articles.
1. T. Gan, Ph.D. Thesis, Massachusetts Institute of Technology, Cambridge, MA (2000).
2. Modeling of Pattern Dependencies for Multi-Level Copper Chemical-Mechanical Polishing Processes
3. Z. Li, L. Borucki, and A. Philipossian, Abstract 899, The Electrochemical Society Meeting Abstracts, Vol. 2003-2, Orlando, FL, Oct 12-16, 2003.
4. Arrhenius Characterization of ILD and Copper CMP Processes
5. Interfacial Fluid Mechanics and Pressure Prediction in Chemical Mechanical Polishing
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