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Pattern Effect Optimized with Non-Native Surface Passivation in Copper Abrasive-Free Polishing

  • Published:2005-05-01 Issue:5 Volume:8 Page:G128-G130
  • ISSN:1099-0062
  • Container-title:Electrochemical and Solid-State Letters
  • language:en
  • Short-container-title:Electrochemical and Solid-State Letters

Author:

Fang J.- Y.,Tsai M. S.,Dai B. T.,Wu Y. S.,Feng M. S.

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Cited by 5 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Novel Abrasion-Free CMP Technology with High Performance Polishing Slurry;2020 China Semiconductor Technology International Conference (CSTIC);2020-06-26

2. Kinetics of corrosion inhibition of benzotriazole to copper in 3.5% NaCl;Materials and Corrosion;2008-08

3. A quartz crystal microbalance study of the kinetics of interaction of benzotriazole with copper;Journal of Applied Electrochemistry;2007-08-23

4. Study on Pressure–Independent Cu Removal in Cu Abrasive–Free Polishing;Electrochemical and Solid-State Letters;2006

5. Roles of Additives in Damascene Copper Electropolishing;Journal of The Electrochemical Society;2006
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