Author:
Spooner Terry A.,Arnold John C.,Canaperi Donald,Chen James,Chen Shyng-Tsong,Gates Stephen M.,Isobayashi Atsunobu,Leung Pak,Papa Rao Satyavolu S.,Sankarapandian Muthumanickam,Shobha Hosadurga,Van der Straten O.
Abstract
In agreement with the ITRS roadmap, there have been several publications supporting the reduction in critical dimensions and the introduction of new materials to semiconductor processing (1,2,3). This paper highlights the observations and solutions to some of the critical material and process interactions encountered during the integration of the back end of line interconnect.
Publisher
The Electrochemical Society
Cited by
7 articles.
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