Chemical Treatment of Low-k Dielectric Surfaces for Patterning of Thin Solid Films in Microelectronic Applications
Author:
Affiliation:
1. Department of Chemistry, University of California, Riverside, California 92521, United States
Funder
Basic Energy Sciences
Publisher
American Chemical Society (ACS)
Subject
General Materials Science
Link
https://pubs.acs.org/doi/pdf/10.1021/acsami.6b00495
Reference56 articles.
1. Process Challenges for Integration of Copper Interconnects with Low-k Dielectrics
2. Lithography and Other Patterning Techniques for Future Electronics
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4. Chemical vapour deposition of coatings
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