Influence of TaN Gate Electrode Microstructure on Its Dry Etch Properties

Author:

Shamiryan D.,Paraschiv V.,Tőkei Z.,Beckx S.,Boullart W.

Publisher

The Electrochemical Society

Subject

Electrical and Electronic Engineering,Electrochemistry,Physical and Theoretical Chemistry,General Materials Science,General Chemical Engineering

Reference20 articles.

1. D.-G. Park, Z. J. Luo, N. Eldeman, W. Zhu, P. Nguyen, K. Wong, C. Cabral, P. Jamison, B. H. Lee, A. Chou, M. Chudzik, J. Bruley, O. Gluschenkov, P. Ronsheim, A. Chakravarti, R. Mitchell, V. Ku, H. Kim, E. Duch, P. Kozlowski, C. D’Emic, V. Narayanan, A. Steegen, R. Wise, R. Jammy, R. Rengarajan, H. Ng, A. Sekiguchi, and C. H. Wann , in Proceedings of the VLSI Symposium , p. 186 (2004).

2. Mobility Enhancement in TaN Metal-Gate MOSFETs Using Tantalum Incorporated HfO<tex>$_2$</tex>Gate Dielectric

3. Physical and electrical properties of lanthanide-incorporated tantalum nitride for n-channel metal-oxide-semiconductor field-effect transistors

4. Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions

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