Tantalum as a diffusion barrier between copper and silicon: Failure mechanism and effect of nitrogen additions
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.350566
Reference37 articles.
1. Transition metals in silicon
2. Multicarrier trapping by copper microprecipitates in silicon
3. Diffusion barriers in thin films
4. Electrical and Metallurgical Characterization of Niobium as a Diffusion Barrier Between Aluminum and Silicon for Integrated Circuit Devices
5. Interfacial reactions between Al and RuO2, MoOxand WNxdiffusion barriers on Si
Cited by 441 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Plasma‐Enhanced Atomic Layer Deposition of Amorphous Tantalum Thin Films for Copper Interconnects Using an Organometallic Precursor;Advanced Materials Technologies;2023-12-28
2. Structure of Ta/TaN Nanolayered Systems Investigated by Transmission Electron Microscopy;Defect and Diffusion Forum;2023-12-12
3. Alloy strengthening toward improving mechanical and tribological performances of CuxNi100−x/Ta nano multilayer materials;Tribology International;2023-12
4. Materials Quest for Advanced Interconnect Metallization in Integrated Circuits;Advanced Science;2023-06-15
5. Direct Fabrication of a Copper RTD over a Ceramic-Coated Stainless-Steel Tube by Combination of Magnetron Sputtering and Sol–Gel Techniques;Sensors;2023-06-08
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3