Author:
Eom Yong-Sung,Son Ji-Hye,Bae Hyun-Cheol,Choi Kwang-Seong,Lee Jin-Ho
Funder
R&D program of ISTK (development of an image-based, real-time inspection and isolation system for hyperfine faults)
Nano-Convergence Foundation
Ministry of Science, ICT and Future Planning
Ministry of Trade, Industry and Energy
KEIT IT R&D program of the Daeduck Innoplis Foundation (commercialization of Ag-coated Cu paste material with low melting point)
Electronics and Telecommunications Research Institute
Subject
Electrical and Electronic Engineering,General Computer Science,Electronic, Optical and Magnetic Materials
Reference22 articles.
1. “High Performance No-flow Underfills for Low-Cost Flip-Chip Applications: Material Characterization,”;Wong;IEEE Trans. Compon., Packag., Manuf. Technol.: A,1998
2. “Characterization of Fluxing and Hybrid Underfills with Micro-Encapsulated Catalyst for Long Pot Life,”;Eom;ETRI J.,2014
3. “Electrical Interconnection with a Smart ACA Composed of Fluxing Polymer and Solder Powder,”;Eom;ETRI J.,2010
4. “Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film,”;Eom;Microelectron. Eng.,2008
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