Characterization of polymer matrix and low melting point solder for anisotropic conductive film-Reference-Cited by-同舟云学术

Characterization of polymer matrix and low melting point solder for anisotropic conductive film

Published:2008-02 Issue:2 Volume:85 Page:327-331
ISSN:0167-9317
Container-title:Microelectronic Engineering
language:en
Short-container-title:Microelectronic Engineering

Author:

Eom Yong-Sung,Baek Ji-Won,Moon Jong-Tae,Nam Jae-Do,Kim Jong-Min

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Flip Chip Technologies;Lau,1995

2. Contraction stress build-up of anisotropic conductive films (ACFs) for flip-chip interconnection: Effect of thermal and mechanical properties of ACFs

3. Effects of bonding pressure on the thermo-mechanical reliability of ACF interconnection

4. ELECTRICAL PROPERTIES OF SOLDER FILLED ANISOTROPICALLY CONDUCTIVE ADHESIVES

5. Isotropic conductive adhesives with fusible filler particles

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