Effects of low melting point SnBi58 alloy on the properties of isotropic conductive adhesives

Author:

Zhang Weiwei,Zhang Zheng,Liu Hao,Wang Jianqiang,Duan Fangcheng,Lv Ziwen,Chen Wentong,Wang Xinjie,Li Mingyu,Chen Chuantong,Chen Hongtao

Funder

China Scholarship Council

NEDO

Publisher

Elsevier BV

Subject

Polymers and Plastics,General Chemical Engineering,Biomaterials

Reference27 articles.

1. Mitsukazu O, Irifune A, Ichikawa N, Harada M, Furusho R, Kondo T, Okuda A. Thermally-conductive, electrically-conductive adhesive composition. WO2014104046 A1.

2. Nano-conductive adhesives for nano-electronics interconnection;Yi,2010

3. Study of processing variables on the electrical resistivity of conductive adhesives;Wu;Int J Adhesion Adhes,2009

4. Electrical reliability of electrically conductive adhesive joints: dependence on curing condition and current density;Kim;Microelectron J,2001

5. Electro-conductive adhesives for high density package and flip-chip interconnections;Wojciechowski;Microelectron Reliab,2000

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