High performance no-flow underfills for low-cost flip-chip applications: material characterization-Reference-Cited by-同舟云学术

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High performance no-flow underfills for low-cost flip-chip applications: material characterization

Published:1998 Issue:3 Volume:21 Page:450-458
ISSN:1070-9886
Container-title:IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
language:
Short-container-title:IEEE Trans. Comp., Packag., Manufact. Technol. A

Author:

Wong C.P.,Shi S.H.,Jefferson G.

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

General Engineering

Link

http://xplorestaging.ieee.org/ielx4/95/15633/00725209.pdf?arnumber=725209

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