Hybrid Bonding of Nanotwinned Copper/organic Dielectrics with Low Thermal Budget-Reference-Cited by-同舟云学术

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Hybrid Bonding of Nanotwinned Copper/organic Dielectrics with Low Thermal Budget

Published:2021-06 Issue: Volume: Page:
ISSN:
Container-title:2021 IEEE 71st Electronic Components and Technology Conference (ECTC)
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Author:

Shie Kai-Cheng,He Pin-Syuan,Kuo Yu-Hao,Ong Jia Juen,Tu K.N.,Lin Benson Tzu-Hung,Chang Chia-Cheng,Chen Chih

Funder

Ministry of Education (MOE)

Ministry of Science and Technology, Taiwan

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9501397/9501403/09501720.pdf?arnumber=9501720

Cited by 11 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Chemical mechanical planarization of nanotwinned copper/polyimide for low temperature hybrid bonding;Journal of Electroanalytical Chemistry;2024-09

2. Comparison of Organic and Inorganic Dielectric Hybrid Bonding with Highly <111>-Oriented Nanotwinned Cu;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

3. Research progress of hybrid bonding technology for three-dimensional integration;Microelectronics Reliability;2024-04

4. A Review on Hybrid Bonding Interconnection and Its Characterization;IEEE Nanotechnology Magazine;2024-04

5. Potassium hydroxide surface modification for low temperature Cu/SiO2 hybrid bonding;Surfaces and Interfaces;2023-08

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