Author:
Ong Jia-Juen,Tran Dinh-Phuc,Chiu Wei-Lan,Yang Shih-Chi,Yu Min-Hsun,Shen Fang-Chun,Chang Hsiang-Hung,Lee Ou-Hsiang,Chiang Chia-Wen,Wang Chin-Hung,Wu Wen-Wei,Chen Chih
Funder
Semiconductor Research Corporation
Ministry of Education
National Science and Technology Council
Subject
Surfaces, Coatings and Films,General Physics and Astronomy,Condensed Matter Physics,Surfaces and Interfaces,General Chemistry
Reference35 articles.
1. Scalable, sub 2μm pitch, Cu/SiCN to Cu/SiCN hybrid wafer-to-wafer bonding technology;Beyne,2017
2. Low-temperature Cu/SiO2 hybrid bonding with low contact resistance using (111)-oriented Cu surfaces;Ong;Materials (Basel),2022
3. Hybrid bonding of nanotwinned copper/organic dielectrics with low thermal budget;Shie,2021
4. Direct Cu to Cu bonding and alternative bonding techniques in 3D packaging;Suga,2021
5. Novel stacked CMOS image sensor with advanced Cu2Cu hybrid bonding;Kagawa,2016
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献