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Characterization of Fluxing and Hybrid Underfills with Micro-encapsulated Catalyst for Long Pot Life

  • Published:2014-06-01 Issue:3 Volume:36 Page:343-351
  • ISSN:1225-6463
  • Container-title:ETRI Journal
  • language:en
  • Short-container-title:ETRI J

Author:

Eom Yong-Sung,Son Ji-Hye,Jang Keon-Soo,Lee Hak-Sun,Bae Hyun-Cheol,Choi Kwang-Seong,Choi Heung-Soap

Publisher

Wiley

Subject

Electrical and Electronic Engineering,General Computer Science,Electronic, Optical and Magnetic Materials

Cited by 20 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability of Indium Solder Joints using a Laser-Assisted Bonding (LAB) Process at Room Temperature;2024 IEEE 74th Electronic Components and Technology Conference (ECTC);2024-05-28

2. Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology;2023 24th European Microelectronics and Packaging Conference & Exhibition (EMPC);2023-09-11

3. Micro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

4. Process window of simultaneous transfer and bonding materials using laser‐assisted bonding for mini‐ and micro‐LED display panel packaging;ETRI Journal;2023-04

5. Epoxy based Solder Paste for Flexible Substrate with Laser Assisted Bonding Process;2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC);2022-09-13
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