Micro-structure analysis of solder joint using room temperature Laser-Assisted Bonding (LAB) process
Author:
Affiliation:
1. Electronics and Telecommunications Research Institute,ICT Creative Laboratory,Daejeon,Korea
Funder
National Research Foundation of Korea
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10195193/10195244/10195779.pdf?arnumber=10195779
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1. Brittle Fracture Behavior of Sn-Ag-Cu Solder Joints with Ni-Less Surface Finish via Laser-Assisted Bonding;Materials;2024-07-22
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