Device-correlated metrology for overlay measurements-Reference-Cited by-同舟云学术

Device-correlated metrology for overlay measurements

Published:2014-10-06 Issue:4 Volume:13 Page:041404
ISSN:1932-5150
Container-title:Journal of Micro/Nanolithography, MEMS, and MOEMS
language:en
Short-container-title:J. Micro/Nanolith. MEMS MOEMS

Author:

Chen Charlie¹,Huang George K. C.¹,Pai Yuan Chi¹,Wu Jimmy C. H.¹,Cheng Yu Wei¹,Hsu Simon C. C.¹,Yu Chun Chi¹,Amir Nuriel²,Choi Dongsub³,Itzkovich Tal²,Tarshish-Shapir Inna²,Tien David C.⁴,Huang Eros⁵,Kuo Kelly T. L.⁵,Kato Takeshi⁶,Inoue Osamu⁶,Kawada Hiroki⁶,Okagawa Yutaka⁶,Huang Luis⁷,Hsu Matthew⁷,Su Amei⁷

Affiliation:

1. United Microelectronics Corporation, Fab12 Engineering, No. 18, Nan-Ke 2nd Road, Science-based Industrial Park, Hsin-Shi, Tainan 744, Taiwan

2. KLA-Tencor Israel, Optical Metrology Division Application, 1 Halavyan Street, Migdal Ha’emek, 23100, Israel

3. KLA-Tencor Korea, Optical Metrology Division Application, 7th Floor Star Plaza Building 92-7, Bansong-dong, Hwasung, Gyeonggi-do 445-160, Republic of Korea

4. KLA-Tencor Corporation United States, Optical Metrology Division Application, One Technology Drive, Milpitas, California 95035, United States

5. KLA-Tencor Taiwan, Optical Metrology Division Application, Tai Yuen Hi-Tech Industrial Park, No. 22 Taiyuan Street, Zhubei, ChuPei, HsinChu, Hsien, Hsinchu 302, Taiwan

6. Hitachi High-Technologies Corporation Japan, Metrology and Inspection Division, 24-14, Nishi-Shimbashi 1-chome, Minato-ku, Tokyo 105-8717, Japan

7. Hitachi High-Technologies Taiwan Corporation Taiwan, 1F, No. 12, Lane 31, Section 1, Huandong Road, Xinshi, Shiang, Tainan 744, Taiwan

Publisher

SPIE-Intl Soc Optical Eng

Subject

Electrical and Electronic Engineering,Mechanical Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference10 articles.

1. Overlay accuracy fundamentals

2. Overlay quality metric

3. Overlay accuracy calibration

4. Quality metric for accurate overlay control in <20nm nodes

5. Multi-level overlay techniques for improving DPL overlay control

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