Metrology target design (MTD) solution for diagonally orientated DRAM layer-Reference-Cited by-同舟云学术

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Metrology target design (MTD) solution for diagonally orientated DRAM layer

Published:2016-03-08 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
language:
Short-container-title:

Author:

Lee Myungjun¹,Smith Mark D.¹,Adel Michael E.²,Chen Chia-Hung³,Huang Chin-Chang³,Huang Hao-Lun³,Tsai Hsueh-Jen³,Wang I-Lin³,Huang Jen-Chou³,Chin Jo-Lan³,Chou Kuo-Yao³,Lan Yuan-Ku³,Lung Hsien-Yen³,Yang Jui-Chin³,Itzkovich Tal²,Huang Healthy⁴,Abramovitz Yaniv²,Song Jinyan⁴,Dror Chen⁴,Cheng Harvey⁴,Levy Ady¹

Affiliation:

1. KLA-Tencor Corp. (United States)

2. KLA-Tencor Israel (Israel)

3. Inotera (Taiwan)

4. KLA-Tencor Taiwan (Taiwan)

Publisher

SPIE

Reference12 articles.

1. Lithography and mask challenges at the leading edge;Levinson,2015

2. EUV resolution enhancement techniques (RETs) for f1 0.4 and below,;Hsu,2015

3. Overlay target design and evaluation for SADP process

4. Diffraction based overlay and image based overlay on production flow for advanced technology node

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Metrology challenges for in-line process control;SPIE Proceedings;2017-04-21

2. Process resilient overlay target designs for advanced memory manufacture;SPIE Proceedings;2017-03-30

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