Lithography aware overlay metrology target design method

Author:

Lee Myungjun1,Smith Mark D.1,Lee Joonseuk2,Jung Mirim2,Lee Honggoo2,Kim Youngsik2,Han Sangjun2,Adel Michael E.3,Lee Kangsan4,Lee Dohwa4,Choi Dongsub4,Liu Zephyr4,Itzkovich Tal3,Levinski Vladimir3,Levy Ady1

Affiliation:

1. KLA-Tencor Corp. (United States)

2. SK Hynix (Korea, Republic of)

3. KLA-Tencor Israel (Israel)

4. KLA-Tencor Korea (Korea, Republic of)

Publisher

SPIE

Reference14 articles.

1. Lithography and mask challenges at the leading edge;Levinson,2015

2. EUV resolution enhancement techniques (RETs) for f1 0.4 and below,;Hsu,2015

3. Overlay target design and evaluation for SADP process,;Yeh,2012

4. Diffraction based overlay and image based overlay on production flow for advanced technology node,;Blancquaert,2013

5. Device-correlated metrology for overlay measurements

Cited by 4 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Image-based overlay target design using a grating intersection;Journal of Micro/Nanopatterning, Materials, and Metrology;2022-09-05

2. Improved device overlay by litho aberration tracking with novel target design for DRAM;Metrology, Inspection, and Process Control for Microlithography XXXIV;2020-03-20

3. Process resilient overlay target designs for advanced memory manufacture;SPIE Proceedings;2017-03-30

4. Quantifying imaging performance bounds of extreme dipole illumination in high NA optical lithography;SPIE Proceedings;2016-10-03

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