1. The need for EUV lithography at advanced technology for sustainable wafer cost;Mallik,2013
2. Pattern fidelity verification for logic design in EUV lithography;Sugawara,2014
3. EUV telecentricity and shadowing errors impact on process margins;Civay,2015
4. Pushing multiple patterning in sub-10nm: are we ready?;Pan,2015
5. A novel methodology for triple/multiple-patterning layout decomposition;Ghaida,2012