High chi block copolymer DSA to improve pattern quality for FinFET device fabrication

Author:

Tsai Hsinyu,Miyazoe Hiroyuki,Vora Ankit,Magbitang Teddie,Arellano Noel,Liu Chi-Chun,Maher Michael J.,Durand William J.,Dawes Simon J.,Bucchignano James J.,Gignac Lynne,Sanders Daniel P.,Joseph Eric A.,Colburn Matthew E.,Willson C. Grant,Ellison Christopher J.,Guillorn Michael A.

Publisher

SPIE

Reference5 articles.

1. FinFET performance advantage at 22nm: An AC perspective.;Guillorn,2008

2. Two-Dimensional Pattern Formation Using Graphoepitaxy of PS-b-PMMA Block Copolymers for Advanced FinFET Device and Circuit Fabrication

3. Self-aligned line-space pattern customization with directed self-assembly graphoepitaxy at 24nm pitch.;Tsai,2015

4. Double-Patterned Sidewall Directed Self-Assembly and Pattern Transfer of Sub-10 nm PTMSS-b-PMOST

5. Plasma Etching of Directed Self Assembly based Patterns for Aggressively Scaled CMOS Applications.;Miyazoe,2015

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