Selective plasma etching of silicon-containing high chi block copolymer for directed self-assembly (DSA) application-Reference-Cited by-同舟云学术

Selective plasma etching of silicon-containing high chi block copolymer for directed self-assembly (DSA) application

Published:2021-07 Issue:4 Volume:39 Page:042801
ISSN:2166-2746
Container-title:Journal of Vacuum Science & Technology B
language:en
Short-container-title:Journal of Vacuum Science & Technology B

Author:

Gusmão Cacho Maria Gabriela¹^ORCID,Benotmane Khatia¹,Pimenta-Barros Patricia¹,Bouet Charlotte¹,Rademaker Guido¹^ORCID,Argoud Maxime¹,Navarro Christophe²^ORCID,Tiron Raluca¹^ORCID,Possémé Nicolas¹^ORCID

Affiliation:

1. Université Grenoble Alpes, CEA, Leti, F-38000 Grenoble, France

2. ARKEMA FRANCE, Route Nationale 117, 64170 Lacq, France

Funder

Region Auvergne-Rhone Alpes

Electronic Components and Systems for European Leadership

Agence Nationale de la Recherche

Publisher

American Vacuum Society

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Process Chemistry and Technology,Instrumentation,Electronic, Optical and Magnetic Materials

Link

https://avs.scitation.org/doi/pdf/10.1116/6.0001102

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3. Triblock Azo copolymers: RAFT synthesis, properties, thin film self-assembly and applications;Polymer-Plastics Technology and Materials;2021-12-22

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