Hybrid metrology solution for 1X node technology-Reference-Cited by-同舟云学术

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Hybrid metrology solution for 1X node technology

Published:2012-03-29 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Vaid Alok,Elia Alexander,Kelling Mark,Allgair John,Hartig Carsten,Ebersbach Peter,McLellan Erin,Sendelbach Matthew,Saleh Nedal,Rana Narender,Kawada Hiroki,Ikegami Toru,Ikeno Masahiko,Kawasaki Takahiro,Bozdog Cornel,Kim Helen,Arnon Elad,Koret Roy,Turovets Igor

Publisher

SPIE

Cited by 12 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. State of the Art and Future Perspectives in Advanced CMOS Technology;Nanomaterials;2020-08-07

2. A holistic metrology sensitivity study for pattern roughness quantification on EUV patterned device structures with mask design induced roughness;Metrology, Inspection, and Process Control for Microlithography XXXII;2018-08-02

3. Application of advanced hybrid metrology method to nanoimprint lithography;SPIE Proceedings;2017-03-28

4. Hybrid enabled thin film metrology using XPS and optical;SPIE Proceedings;2016-03-24

5. Innovative scatterometry approach for self-aligned quadruple patterning (SAQP) process control;SPIE Proceedings;2016-03-24

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