Hybrid enabled thin film metrology using XPS and optical

Author:

Vaid Alok1,Iddawela Givantha1,Mahendrakar Sridhar1,Lenahan Michael1,Hossain Mainul1,Timoney Padraig1,Bello Abner F.1,Bozdog Cornel2,Pois Heath2,Lee Wei Ti2,Klare Mark2,Kwan Michael2,Kang Byung Cheol3,Isbester Paul3,Sendelbach Matthew3,Yellai Naren3,Dasari Prasad3,Larson Tom2

Affiliation:

1. GLOBALFOUNDRIES, Inc. (United States)

2. ReVera Inc. (United States)

3. Nova Measuring Instruments, Inc. (United States)

Publisher

SPIE

Reference6 articles.

1. Impact of shrinking measurement error budgets on qualification metrology sampling and cost,;Sendelbach,2014

2. ISO Guide to the Expression of Uncertainty in Measurement, ISO, Geneva, 2006

3. A holistic metrology approach: hybrid metrology utilizing scatterometry, CD-AFM, and CD-SEM,;Vaid,2011

4. Nested uncertainties and hybrid metrology to improve measurement accuracy,;Silver,2011

5. Hybrid metrology solution for 1X node technology,;Vaid,2012

Cited by 3 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献

1. Review of nanosheet metrology opportunities for technology readiness;Journal of Micro/Nanopatterning, Materials, and Metrology;2022-04-18

2. Metrology and inspection required for next generation lithography;Japanese Journal of Applied Physics;2017-04-24

3. Complex metrology on 3D structures using multi-channel OCD;SPIE Proceedings;2017-03-28

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