Innovative scatterometry approach for self-aligned quadruple patterning (SAQP) process control-Reference-Cited by-同舟云学术

Innovative scatterometry approach for self-aligned quadruple patterning (SAQP) process control

Published:2016-03-24 Issue: Volume: Page:
ISSN:0277-786X
Container-title:SPIE Proceedings
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Author:

Gunay-Demirkol Anil¹,Altamirano Sanchez Efrain¹,Heraud Stephane²,Godny Stephane¹,Charley Anne-Laure¹,Leray Philippe¹,Urenski Ronen³,Cohen Oded³,Turovets Igor³,Wolfling Shay³

Affiliation:

1. IMEC (Belgium)

2. Nova Measuring Instruments GmbH (Germany)

3. Nova Measuring Instruments LTD (Israel)

Publisher

SPIE

Reference3 articles.

1. Self-aligned-quadruple-patterning for N7/N5 silicon fins;Altamirano-Sánchez,2016

2. Metal1 patterning study for random-logic applications with 193i, using calibrated OPC for litho and etch;Mailfert,2014

3. Hybrid metrology solution for 1X node technology

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