Adhesion and collapse of extreme ultraviolet photoresists and the role of underlayers
Author:
Affiliation:
1. IMEC, Leuven, Belgium
Publisher
SPIE-Intl Soc Optical Eng
Subject
General Arts and Humanities
Reference26 articles.
1. High-NA EUV lithography exposure tool: advantages and program progress
2. Underlayer optimization method for EUV lithography
3. Explorations of missing hole defect in EUV patterning
4. Pattern collapse mitigation strategies for EUV lithography
5. Fundamentals of EUV resist-inorganic hardmask interactions
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1. Relationship between the surface free energy of underlayers and the dissolution kinetics of poly(4-hydroxystyrene) partially protected by t-butoxycarbonyl groups in tetramethylammonium hydroxide aqueous developer;Japanese Journal of Applied Physics;2024-09-02
2. Novel EUV Underlayer Design for Metal Oxide Resist Patterning;Journal of Photopolymer Science and Technology;2024-06-25
3. Enhancement of photosensitivity and stability of Sn-12 EUV resist by integrating photoactive nitrate anion;Applied Surface Science;2024-05
4. Lithography performance improvement of MOR by underlayers;Advances in Patterning Materials and Processes XLI;2024-04-09
5. Functional underlayers for dose reduction and collapse mitigation in EUV lithography: a factorial analysis;International Conference on Extreme Ultraviolet Lithography 2023;2023-11-21
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