On the pressure effect in energetic deposition of Cu thin films by modulated pulsed power magnetron sputtering: A global plasma model and experiments
Author:
Affiliation:
1. Surface Engineering Laboratory, School of Materials Science and Engineering, Dalian University of Technology, Dalian 116024, China
Funder
National Natural Science Foundation of China (NSFC)
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4921443
Reference69 articles.
1. A novel pulsed magnetron sputter technique utilizing very high target power densities
2. High power impulse magnetron sputtering discharge
3. Plasma dynamics in a highly ionized pulsed magnetron discharge
4. On the electron energy in the high power impulse magnetron sputtering discharge
5. Discharge physics of high power impulse magnetron sputtering
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