Formation of TiN‐encapsulated copper structures in a NH3ambient
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.106783
Reference11 articles.
1. Diffusion of Metals in Silicon Dioxide
2. Oxidation and protection in copper and copper alloy thin films
3. In situ investigation of TiN formation on top of TiSi2
4. Simultaneous formation of TiN and TiSi2by lamp annealing in NH3ambient and its application to diffusion barriers
5. Intermetallic compound formations in titanium‐copper thin‐film couples
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