A Study on the Diffuse Mechanism and the Barrier Property of Copper Manganese Alloy on Tantalum
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Published:2015-05
Issue:3
Volume:3
Page:284-290
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ISSN:2168-6734
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Container-title:IEEE Journal of the Electron Devices Society
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language:
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Short-container-title:IEEE J. Electron Devices Soc.
Author:
Su Ying-Sen,Lee Wen-Hsi,Chang Shih-Chieh,Wang Ying-Lang
Funder
National Science Council of Taiwan
Publisher
Institute of Electrical and Electronics Engineers (IEEE)
Subject
Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Biotechnology