Investigation the Electroplating Behavior of Self Formed CuMn Barrier-Reference-Cited by-同舟云学术

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Investigation the Electroplating Behavior of Self Formed CuMn Barrier

Published:2013-08-01 Issue:8 Volume:13 Page:5800-5806
ISSN:1533-4880
Container-title:Journal of Nanoscience and Nanotechnology
language:en
Short-container-title:j. nanosci. nanotech.

Author:

Wu Chia-Yang,Lee Wen-Hsi,Chang Shih-Chieh,Wang Ying-Lang

Publisher

American Scientific Publishers

Subject

Condensed Matter Physics,General Materials Science,Biomedical Engineering,General Chemistry,Bioengineering

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. A Novel Method to Fabricate a Thick-Film Cu Electrode Fired in Air Through Printing Al Electrode and Reduction-Oxidation Substitution Reaction;IEEE Transactions on Components, Packaging and Manufacturing Technology;2021-03

2. Etching Feasibility of CoWP and CoWB as Selective Metallic Capping Layer in Cu Dual Damascene Interconnection;Science of Advanced Materials;2017-11-01

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