Etching Feasibility of CoWP and CoWB as Selective Metallic Capping Layer in Cu Dual Damascene Interconnection
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Published:2017-11-01
Issue:11
Volume:9
Page:2019-2025
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ISSN:1947-2935
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Container-title:Science of Advanced Materials
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language:en
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Short-container-title:sci adv mater
Author:
Cui Yinhua,Choi Eunmi,Shim Ho Jae,Gao Yuan,Pyo Sung Gyu
Publisher
American Scientific Publishers
Subject
General Materials Science