Subject
General Physics and Astronomy
Reference49 articles.
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2. Microstructure and reliability of copper interconnects
3. Dry patterning of copper films using an O2 plasma and hexafluoroacetylacetone
4. Microtexture and electromigration-induced drift in electroplated damascene Cu
5. The effect of interlevel dielectric on the critical tensile stress to void nucleation for the reliability of Cu interconnects
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