Microtexture and electromigration-induced drift in electroplated damascene Cu
Author:
Publisher
AIP Publishing
Subject
General Physics and Astronomy
Link
http://aip.scitation.org/doi/pdf/10.1063/1.372258
Reference31 articles.
1. Recrystallization kinetics of electroplated Cu in damascene trenches at room temperature
2. Electromigration in copper conductors
3. Texture analysis of damascene-fabricated Cu lines by x-ray diffraction and electron backscatter diffraction and its impact on electromigration performance
4. Electromigration in thin gold films on molybdenum surfaces
5. Electromigration-induced drift in damascene and plasma-etched Al(Cu). II. Mass transport mechanisms in bamboo interconnects
Cited by 49 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. The Connection Between Electromigration Resistance and Thin-Film Adhesion and Their Degradation With Temperature;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-03
2. Plasma oxidation as an effective method in etching copper interconnect lines at room-temperature;Japanese Journal of Applied Physics;2022-03-01
3. Communication—Exploration of Plasma Oxidized Copper Oxide as a Copper Passivation Layer;ECS Journal of Solid State Science and Technology;2022-03-01
4. Self-aligned Copper Oxide Passivation Layer — A Study on the Reliability Effect;MRS Advances;2020-12
5. Metal Capping Layer Effects on Electromigration Failure Phenomena of Plasma Etched Copper Lines;ECS Journal of Solid State Science and Technology;2020-11-02
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3