Improvement of thermal stability and composition changes of atomic layer deposited HfO2 on Si by in situ O3 pretreatment
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2721845
Reference10 articles.
1. Reaction–diffusion in high-k dielectrics on Si
2. Chemical interaction between atomic-layer-deposited HfO2 thin films and the Si substrate
3. Influence of the oxygen concentration of atomic-layer-deposited HfO2 gate dielectric films on the electron mobility of polycrystalline-Si gate transistors
4. Electrical characteristics of high-quality sub-25-/spl Aring/ oxides grown by ultraviolet ozone exposure at low temperature
5. Y. Morisaki, Y. Sugita, K. Irino, and T. Aoyama, Extended Abstracts of the International Workshop on Gate Insulator (IEEE, New York, 2001), p. 184.
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1. Impurity and silicate formation dependence on O3 pulse time and the growth temperature in atomic-layer-deposited La2O3 thin films;The Journal of Chemical Physics;2017-02-07
2. Improving the Electrical Properties of Lanthanum Silicate Films on Ge Metal Oxide Semiconductor Capacitors by Adopting Interfacial Barrier and Capping Layers;ACS Applied Materials & Interfaces;2014-04-29
3. Chemical structures and electrical properties of atomic layer deposited HfO2 thin films grown at an extremely low temperature (≤100°C) using O3 as an oxygen source;Applied Surface Science;2014-02
4. Effects of O3 and H2O as oxygen sources on the atomic layer deposition of HfO2 gate dielectrics at different deposition temperatures;J. Mater. Chem. C;2014
5. Front End of the Line Process;Atomic Layer Deposition for Semiconductors;2013-10-19
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