Scanning transmission electron microscopy investigations of self-forming diffusion barrier formation in Cu(Mn) alloys on SiO2
Author:
Publisher
AIP Publishing
Subject
General Engineering,General Materials Science
Link
http://aip.scitation.org/doi/pdf/10.1063/1.4822441
Reference18 articles.
1. Ultrathin Diffusion Barriers/Liners for Gigascale Copper Metallization
2. Evaluation of amorphous (Mo, Ta, W)SiN diffusion barriers for 〈Si〉|Cu metallizations
3. Self-forming diffusion barrier layer in Cu–Mn alloy metallization
4. Growth kinetics and thermal stability of a self-formed barrier layer at Cu-Mn∕SiO2 interface
5. Phase identification of self-forming Cu–Mn based diffusion barriers on p-SiOC:H and SiO2 dielectrics using x-ray absorption fine structure
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