Self-strengthening of electroless-plated copper via dual segregation of extremely dilute (0.1%) manganese oxide inclusions
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference20 articles.
1. On the use of alloying elements for Cu interconnect applications
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1. Reinforcement in electromigration reliability of Cu interconnects by alloying of extremely dilute MnO;Journal of Alloys and Compounds;2023-08
2. Electroless Metallization of the Elements: Survey and Progress;ACS Applied Electronic Materials;2022-12-07
3. Thermodynamic route for self-forming 1.5 nm V-Nb-Mo-Ta-W high-entropy alloy barrier layer: Roles of enthalpy and mixing entropy;Acta Materialia;2020-10
4. Mechanism of strengthening electroless plated copper films with extremely dilute oxide dispersion alloying: The optimal MnO addition;Applied Surface Science;2020-10
5. A New Alternative Electrochemical Process for a Pre-Deposited UPD-Mn Mediated the Growth of Cu(Mn) Film by Controlling the Time during the Cu-SLRR;Coatings;2020-02-11
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