Characterization of focused-ion-beam-induced damage in n-type silicon using Schottky contact
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.2195109
Reference19 articles.
1. A review of focused ion beam applications in microsystem technology
2. Recent developments in micromilling using focused ion beam technology
3. Effects of Ion Species and Energy on the Amorphization of Si During FIB TEM Sample Preparation as Determined by Computational and Experimental Methods
4. Transmission Electron Microscopy Studies of the Nanoscale Structure and Chemistry of Pt50Ru50 Electrocatalysts
5. Surface damage formation during ion-beam thinning of samples for transmission electron microscopy
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