Low‐energy high flux reactive ion etching by rf magnetron plasma
Author:
Publisher
AIP Publishing
Subject
Physics and Astronomy (miscellaneous)
Link
http://aip.scitation.org/doi/pdf/10.1063/1.94702
Reference6 articles.
1. A kinetic study of the plasma‐etching process. I. A model for the etching of Si and SiO2in CnFm/H2and CnFm/O2plasmas
2. Plasma etching—A discussion of mechanisms
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4. Plasma Etch Anisotropy—Theory and Some Verifying Experiments Relating Ion Transport, Ion Energy, and Etch Profiles
5. Magnetron sputtering: basic physics and application to cylindrical magnetrons
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