GaN-on-diamond technology platform: Bonding-free membrane manufacturing process-Reference-Cited by-同舟云学术

GaN-on-diamond technology platform: Bonding-free membrane manufacturing process

Published:2020-03-01 Issue:3 Volume:10 Page:035306
ISSN:2158-3226
Container-title:AIP Advances
language:en
Short-container-title:AIP Advances

Author:

Smith Matthew D.¹^ORCID,Cuenca Jerome A.²^ORCID,Field Daniel E.³,Fu Yen-chun¹,Yuan Chao³^ORCID,Massabuau Fabien⁴^ORCID,Mandal Soumen²^ORCID,Pomeroy James W.³^ORCID,Oliver Rachel A.⁴^ORCID,Uren Michael J.³^ORCID,Elgaid Khaled²^ORCID,Williams Oliver A.²^ORCID,Thayne Iain¹^ORCID,Kuball Martin³^ORCID

Affiliation:

1. School of Engineering, University of Glasgow, Glasgow G12 8LT, United Kingdom

2. School of Engineering, Cardiff University, Cardiff CF24 3AA, United Kingdom

3. Center for Device Thermography and Reliability (CDTR), H. H. Wills Physics Laboratory, University of Bristol, Bristol BS8 1TL, United Kingdom

4. Department of Materials Science and Metallurgy, University of Cambridge, 27 Charles Babbage Road, Cambridge CB3 0FS, United Kingdom

Funder

Engineering and Physical Sciences Research Council

Publisher

AIP Publishing

Subject

General Physics and Astronomy

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