Modeling of electromigration on void propagation at the interface between under bump metallization and intermetallic compound in flip-chip ball grid array solder joints-Reference-Cited by-同舟云学术

Modeling of electromigration on void propagation at the interface between under bump metallization and intermetallic compound in flip-chip ball grid array solder joints

Published:2010-05 Issue:9 Volume:107 Page:093526
ISSN:0021-8979
Container-title:Journal of Applied Physics
language:en
Short-container-title:Journal of Applied Physics

Author:

Jen Ming-Hwa R.,Liu Lee-Cheng,Lai Yi-Shao

Publisher

AIP Publishing

Subject

General Physics and Astronomy

Link

http://aip.scitation.org/doi/pdf/10.1063/1.3369442

Reference17 articles.

1. Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

2. Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects

3. The amorphous origin and the nucleation of intermetallic compounds formed at the interface during the soldering of Sn–3.0Ag–0.5Cu on a Cu substrate

4. Current crowding-induced electromigration in SnAg3.0Cu0.5 microbumps

5. Electromigration of eutectic SnPb solder interconnects for flip chip technology

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