Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects-Reference-Cited by-同舟云学术

Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects

Published:2005-01 Issue:1-2 Volume:391 Page:95-103
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Li Dezhi,Liu Changqing,Conway Paul P.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference41 articles.

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5. Solder reaction-assisted crystallization of electroless Ni–P under bump metallization in low cost flip chip technology

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