Insights Into the Grain Orientation Effect on Electromigration-Induced Failure in Solder Interconnects Through Phase Field Modeling-Reference-Cited by-同舟云学术

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Insights Into the Grain Orientation Effect on Electromigration-Induced Failure in Solder Interconnects Through Phase Field Modeling

Published:2024-01 Issue:1 Volume:71 Page:192-199
ISSN:0018-9383
Container-title:IEEE Transactions on Electron Devices
language:
Short-container-title:IEEE Trans. Electron Devices

Author:

Liang Shuibao¹^ORCID,Jiang Han²,Zhong Zhihong¹,Ramachandran Saranarayanan³

Affiliation:

1. School of Materials Science and Engineering, Hefei University of Technology, Hefei, China

2. Wolfson School of Mechanical, Electrical and Manufacturing Engineering, Loughborough University, Loughborough, U.K

3. Advanced Forming Research Centre, University of Strathclyde, Renfrew, U.K

Funder

Research Foundation for the Introduction of Talent of Hefei University of Technology

Natural Science Foundation of Anhui Province

Publisher

Institute of Electrical and Electronics Engineers (IEEE)

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials

Link

http://xplorestaging.ieee.org/ielx7/16/10382412/10239697.pdf?arnumber=10239697

Reference42 articles.

1. Physics-Based Model for Understanding Electromigration-Induced Cavity Evolution in Advanced Narrow Line Copper Interconnects

2. Impact of Inherent Design Limitations for Cu–Sn SLID Microbumps on Its Electromigration Reliability for 3D ICs

3. Study on reliability of flip chip solder interconnects for high current density packaging;Yang,2008

4. The Role of Elastic and Plastic Anisotropy of Sn in Recrystallization and Damage Evolution During Thermal Cycling in SAC305 Solder Joints

5. Three-Dimensional Finite Element Analysis of Multiple-Grained Lead-Free Solder Interconnects

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